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| TechedgeOnline
Store Item Det |
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Introduction
to BGA Packages
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TE0003
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Price: $49.00 |
You Pay: $25.00
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This course describes the characteristics
and uses of the various BGA package types. Topics include ball
patterns, PBGA parts, CCGA’s, uBGA and CSP packages, full
matrix BGA, lid types, non-eutectic solder balls, power dissipation,
package shapes, parasitics, SBGA’s, solder columns, and
TBGA’s. Study Time 1 Hour
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