SMT INDIA

· Immediate clean ability to the steel plate on line.

· Overcome the blind spot of auto-clean (dry/wet), clean all solder paste on Fine-Pitch steel hole.

· Clean steel hole by ultrasonic vibration, thoroughly clan and never harm the steel plate.

· Doesn’t need to use CFC solvent, no environmental pollution

Feature

· Provide an immediate clean ability to the steel plate on line, ensure the quality in continuous printing.

· Clean thoroughly the dirt located at the corner and tip end.

· Compact design and easy for operation.

· Upgrade the printing superiorty.


Place the absorption pad under the screen, and pour a small amount of solvent (ethanol, butyl acetate, etc) on the screen.	Place the cleaning unit on top of the screen after the solder soften by solvent.	Switch on the power (manual/automatic control)	The solder paste will be absorbed by the pad during the vibration.