PCB Solder Pallet
materials are glass fibre composites specially designed
to meet the various challenges of the pcb assembly
process.
Excellent mechanical properties at elivated tempretures
Ensures optimal thermal distribution across the
PCB
Can be used for solder paste printing SMT Placement
and Reflow.
With
advanced adhesive technology, KHJ splice tape products
are in mass production with a large variety of specification
Advantage: being join without special
tool; increasing efficiancy; reducing machine abrasion;
Zero loss of components.
