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| SMT
TRAINING |
| SMT
TRAINING |
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A&A's training services are
targeted at production, designing, repair and rework areas
of SMT.
These value added services are offered to you with the
expert support from our affiliates worldwide.
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ON-LINE
TRAINING |
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ON-SITE TRAINING |
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A&A acknowledges the potential of world-wide-web
as a popular platform for imparting education &
sharing expertise. Hence A&A has teamed up with
the pioneering industry leader Techedge Online Inc to
offer SMT Training on the internet. These short but
effective Training Programs are the result of years
of exhaustive work of experts from the industry. The
courses are offered at very competitive prices.
Check
On-line Courses
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A&A has designed 2-days & 3-days courses on
SMT with the help of its affiliate Waterfall Technologies
(Canada). These courses are most ideal for group of
people wanting to acquire SMT skills to setup &
run the SMT Production / Repairs facility. This course
can be conducted at customer sites.
Course Description
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PUBLIC
COURSES & SEMINARS |
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AUDITING
/ EVALUATION |
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A&A with its affiliate
Waterfall Technologies organizes public courses
/ seminars in India on "Advanced SMT for High Density
Assembly" & on other specialized topics in
SMT.
Check our Forthcoming
Courses &
Register
Online
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A&A can undertake process auditing for SMT manufacturing
/ repairs facilities & even offer recommendations
for suitable manufacturing & equipment. With the
support from its experienced affiliates located in Singapore,
US & Canada, A&A can also offer equipment evaluation
services ( at US, Canada & Singapore ) for the customers
interested in buying used / refurbished equipments.
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Request
for Details |
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1
INDUSTRY DIRECTION |
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SOLDER DEPOSITION TECHNOLOGY |
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Influencing
Factors and Impacts
* Where is it headed?
* Overview of Processes:
* Surface Mount, Thru-hole and Mixed, BGAs & processes
involving COB, Flip Chips and CSPs
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Solder Paste Composition & Characteristics
* Fluxes: RMA, WS, No-clean, Low Residue & VOC
* Solder Paste Qualification & Control
* Paste Printing & Deposition Variables
* Stencil Engineering - Etch, Laser & Electro-Formed
* Pad Design & Layout Optimization
* Considerations for Paste Release with Array Devices
& 0402 and 0201
* Substrates & Squeegees Control Aspects
* Printing Process Control & Optimization
* Trouble-shooting Solder Paste Printing |
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4
COMPONENT PLACEMENT SYSTEMS |
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ADVANCED REFLOW SOLDERING |
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Categorization of Placement Equipment
* Placement Accuracy and its Measurement
* Practical Tips & Trouble-shooting Guide:
*Addressing Feeder Issues
*Misplacement, Rotation, Missing, Cracked or Damaged Components |
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High Yield Considerations
* Solder Volume Requirements
* Perfecting Thermal Profiling Methods
* Reflow Process Window Development
* Inert Gas Soldering - Pros & Cons
* Trouble-shooting - Solder beading, Solder balling and
Tombstoning |
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NEW DEVELOPMENTS & INDUSTRY TRENDS |
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UNDERSTANDING SOLDER JOINT QUALITY |
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Enclosed Head Printing
* Reflow Equipment Refinements
* Dual Lane Approaches
* Ramp Profiles
* Lead Free Soldering Considerations & Impacts |
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Typical Defects & Causes
* Soldering Metallurgy & Intermetallics
* Gold, Silver, Tin & Nickel Films
*Joint Strength & Reliability |
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8
THE FUTURE OF SMT |
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9
BALL GRID ARRAYS (BGAs) |
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Packaging Road Map
*Advanced & Emerging
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Families & Structure
* BGA Assembly Considerations
* BGA Thermal Profiling & Assembly Tips
* BGA Assembly Defects & Reliability
* Key Process Control Points & Defect Elimination
* Practical BGA Problems Analysis
* 3D X-ray Tomography, Laminography & Optical
* Endoscopy |
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CHIP SCALE PACKAGING (CSPs) |
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FLIP CHIP & CHIP-ON-BOARD (COB) |
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*Types
of CSP & Structure
* CSP Attachment & Assembly Processes
*CSP Applications |
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Bonding Variables
* Bonding for Low Cost COB Applications
* Flip Chips
* Types of Bump Metallurgies
* Alternate Flip Chip Attachment Processes
* Impact of Underfilling - How & Why?
* Fracture Mechanism & Failure Mode
* Advancements & Innovations in Underfilling
* Flip Chip Test Kits |
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12
REWORK PROCESSES FOR SMT |
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Rework Considerations - When, Where & How?
* Rework Equipment Options & Applications
* Two Terminal, Multi-leaded & FPQFP Rework
* Key Steps in BGA Rework
* Thermal Management during BGA Rework
* Flip Chip & CSP Rework Considerations
* Helpful Practical Tips - Do’s & Don’ts |
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The
2-Day intensive workshop is geared for today’s
complex high density products. The course takes the
attendee step by step from Solder Paste, Deposition,
Placement, Reflow, Solder Joint quality through to Rework
and Emerging trends. At the end participants will be
able to dramatically improve yield, reduce assembly
defects and be fully prepared for on-coming trends.
The program teaches how to select, manage and control
Solder Paste, Deposition Variables, Stencils, Aperture
& Pad design with focus on ultra fine pitch and
small form factor components. You learn how to optimize,
control and manage the entire Printing process. This
is followed by Placement system types and classification
and related issues. Reflow Technology will cover soldering
variables, thermal transfers and types of ovens. Thermal
profiling, its impact on solder joint quality and practical
techniques on optimizing profiling are provided. Each
section covers equipment Specifications, Selection and
Evaluation. You learn how to check, audit, know the
critical areas and be able to troubleshoot each process
step. Real life examples are used to enhance problem
analysis and solving skills. Solder joint quality, defects,
intermetallics and reliability are illustrated with
the help of photomicrographs and micro-sections.
Highlights of the session includes a complete coverage
of BGAs, BGA Trouble-shooting and New Technologies such
as COB, Flip Chip, CSP and Wafer Scale Packaging.
Rework processes for SMT will show you how to cope with
rework and when, where and how to apply it including
thermal considerations.
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Who
Should attend ? |
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Process
Engineering, Quality, Manufacturing, Management and
other users interested in advancing their knowledge
and practical skills in SMT. It also prepares the attendees
in meeting the challenges of emerging interconnection
trends such as BGAs, CSP, COB and Flip Chips. |
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INSTRUCTOR'S
PROFILE |
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Mukul
Luthra graduated with a Degree in Electrical Engineering
in 1974 and has extensive experience in high volume
manufacturing, quality & process engineering in
the PCBA, Disk Drive and Semiconductor industries. He
has over 20 Articles published on SMT, has chaired and
presented at numerous conferences, and is a well-respected
speaker at the Nepcon & GlobalTronics workshops.
His
paper “Process Challenges and Solutions for merging
COB into mainstream SMT” appeared in the APEX
issue of Circuits Assembly, the SMTA Pan Pacific Maui,
the GlobalTronics SMT show, Singapore, the EMAPS Conference,
Taiwan, and rated highly at the the SMTA Conference,
Chicago Sept 03. His column on SMT issues appears in
‘Circuits Assembly’ Magazine.
Mukul
is the Business Director and founder of Waterfall Technologies.
Amongst the previous positions he has held include Marketing
Director, ST
Microelectronics and Director, Seagate Technology.
With
over 27 years of High Tech experience, in Singapore,
the US and Canada, he is a leading professional Trainer
and Consultant known for his
process expertise.
Waterfall
Technologies has served almost every major Multinational
and Small and Medium Enterprise involved with PCB Assembly
in their training needs, hands-on problem solving and
process improvement. The training program and services
offered are world class and on the leading edge of technology.
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